Building system with reduced wiring requirements and apparatus for use therein

ABSTRACT

A controller arrangement for a building system includes a sensor module, an actuator module, and a controller. The sensor module comprises a wireless communication device and a microelectromechanical sensor device operable to generate a process value and a wireless communication device. The actuator module comprises an actuation element and a wireless communication device. The controller is operable to obtain the process value from the sensor module and provide a control output to the actuator module, the controller further operable to communicate with at least one of the sensor module and the actuator module using a wireless communication device. The controller is also connected to receive a set point value, and is operable to generate the control output based on the process value and the set point value.

[0001] This application claims the benefit of U.S. Provisional PatentApplication Serial No. 60/352,452, filed Jan. 28, 2002, and which isincorporated herein by reference.

CROSS REFERENCE TO RELATED APPLICATIONS

[0002] Cross reference is made to co-pending application entitled“Building Control System and Fume Hood System for Use Therein HavingReduced Wiring Requirements”, Attorney Docket No. 2003 P 01153 US, filedon even date herewith, and which is incorporated herein by reference.

FIELD OF THE INVENTION

[0003] The present invention relates generally to building controlsystems, such of the type that control heating, ventilation, airconditioning, fire safety, lighting, security and other systems of abuilding or facility.

BACKGROUND OF THE INVENTION

[0004] Building control systems are employed to regulate and controlvarious environmental and safety aspects of commercial, industrial andresidential facilities (hereinafter referred to as “buildings”). Inordinary single-family residences, control systems tend to be simple andlargely unintegrated. However, in large buildings, building controlsystems often consist of multiple, integrated subsystems employinghundreds of elements.

[0005] For example, a heating, ventilation and air-conditioning (“HVAC”)building control system interrelates small, local control loops withlarger control loops to coordinate the delivery of heat, vented air, andchilled air to various locations throughout a large building. Localcontrol systems may use local room temperature readings to open or closevents that supply heated or chilled air. Larger control loops may obtainmany temperature readings and/or air flow readings to control the speedof a ventilation fan, or control the operation of heating or chillingequipment.

[0006] As a consequence of the interrelationship of these control loops,many elements of a building control system must communicate informationto each other. To this end, communication networks have beenincorporated that transmit digital data between and among the variouselements in accordance with one or more sets of protocols. By way ofexample, one or more local area networks using Ethernet or otherstandard protocols are often used to effect communication betweenelements and subsystems.

[0007] A drawback to the current state of HVAC systems is the amount ofwiring involved in connecting all of the elements of the system in alarge building. A large building may have hundreds of sensors, roomcontrollers, and actuation devices. All of these elements must beinterconnected in some manner so that both local and overall controloperations may be carried out. Installation of the large number of wiresrequired to accomplish such interconnection is labor intensive, andrequires significant material cost.

[0008] As a consequence, there is a need for a building control systemthat reduces the wiring requirements of the current systems.

SUMMARY OF THE INVENTION

[0009] The present addresses the above needs, as well as others, byproviding a building control system that incorporates wirelesscommunications and/or microelectromechanical (“MEMS”) technology. Byincorporating wireless communications, at least some of the wiringemployed for data communication may be eliminated. Preferably, such asystem employs MEMS sensor elements that may be incorporated into sensormodules that include both the sensor element and a local RFcommunication circuit. By employing MEMS sensor elements and local RFcommunication circuits, power requirements are reduced, and sensors maybe implemented with stand-alone power sources, for example, batteries.Battery powered sensor modules may be implemented completely withoutwiring.

[0010] A first embodiment of the invention is a controller arrangementfor a building system that includes a sensor module, an actuator module,and a controller. The sensor module comprises a wireless communicationdevice and a microelectromechanical sensor device operable to generate aprocess value and a wireless communication device. The actuator modulecomprises an actuation element and a wireless communication device. Thecontroller is operable to obtain the process value from the sensormodule and provide a control output to the actuator module, thecontroller further operable to communicate with at least one of thesensor module and the actuator module using a wireless communicationdevice. The controller is also connected to receive a set point value,and is operable to generate the control output based on the processvalue and the set point value.

[0011] Another embodiment of the invention is a building control systemthat includes a plurality of controller arrangements. Each controllerarrangement includes a controller, at least one sensor module, and awireless communication interface. Each controller is operable togenerate a control output value based on at least one process value andat least one set point value. The sensor module is operable to generatethe at least one process value and is operably connected to thecontroller. The wireless communication interface is also operablycoupled to the controller, and is configured to communicate informationwith a remote element of the building control system using a firstwireless communication scheme.

[0012] The above described features and advantages, as well as others,will become more readily apparent to those of ordinary skill in the artby reference to the following detailed description and accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013]FIG. 1 shows a block diagram of an exemplary building controlsystem in accordance with the present invention;

[0014]FIG. 2 shows a block diagram of an exemplary space controlsubsystem of the building control system of FIG. 1;

[0015]FIG. 3 shows a flow diagram of an exemplary set of operations of aroom control processor of the space control subsystem of FIG. 2;

[0016]FIG. 4 shows a flow diagram of an exemplary set of operations of asensor module controller of the space control subsystem of FIG. 2;

[0017]FIG. 5 shows a flow diagram of an exemplary set of operations ofan actuator module controller of the space control subsystem of FIG. 2;

[0018]FIG. 6 shows a side view of an exemplary wireless module accordingto the present invention;

[0019]FIG. 7 shows a diagrammatic block diagram of a module circuit ofthe wireless module of FIG. 6;

[0020]FIG. 8 shows a block diagram of a prior art building automationsystem;

[0021]FIG. 9 shows a block diagram of the building system of FIG. 8 witha retrofitted subsystem in accordance with the invention;

[0022]FIG. 10 shows a block diagram of the building system of FIG. 8with several retrofitted elements in accordance with the invention.

DETAILED DESCRIPTION

[0023]FIG. 1 shows a block diagram of an exemplary building controlsystem in accordance with the present invention. The building controlsystem 100 includes a supervisory computer 102, a wireless area networkserver 104, a chiller controller subsystem 106, a fan controllersubsystem 108, and room controller subsystems 110, 112 and 114. Thebuilding control system 100 includes only the few above-mentionedelements for clarity of exposition of the principles of the invention.Typical building control systems will include many more space controlsubsystems, as well as many more chiller, fan, heater, and otherbuilding HVAC subsystems. Those of ordinary skill in the art may readilyincorporate the methods and features of the invention described hereininto building control systems of larger scale.

[0024] In general, the building control system 100 employs a firstwireless communication scheme to effect communications between thesupervisory computer 102, the chiller controller subsystem 106, the fancontroller subsystem 108, and the room controller subsystems 110, 112and 114. A wireless communication scheme identifies the specificprotocols and RF frequency plan employed in wireless communicationsbetween sets of wireless devices. In the embodiment described herein,the first wireless communication scheme is implemented as a wirelessarea network. To this end, a wireless area network server 104 coupled tothe supervisory computer 102 employs a packet-hopping wireless protocolto effect communication by and among the various subsystems of thebuilding control system 100. U.S. Pat. No. 5,737,318, which isincorporated herein by reference, describes a wireless packet hoppingnetwork that is suitable for HVAC/building control systems ofsubstantial size.

[0025] In general, the chiller controller subsystem 106 is a subsystemthat is operable to control the operation of a chiller plant, not shown,within the building. Chiller plants, as is known in art, are systemsthat are capable of chilling air that may then be ventilated throughoutall or part of the building to enable air conditioning. Variousoperations of chiller plants depend upon a number of input values, as isknown in the art. Some of the input values may be generated within thechiller controller subsystem 106, and other input values are externallygenerated. For example, operation of the chiller plant may be adjustedbased on various air flow and/or temperature values generated throughoutthe building. The operation of the chiller plant may also be affected byset point values generated by the supervisory computer 102. Theexternally-generated values are communicated to the chiller controllersubsystem 106 using the wireless area network.

[0026] The fan controller subsystem 108 is a subsystem that is operableto control the operation of a ventilation fan, not shown, within thebuilding. A ventilation fan, as is known in art, is a prime mover of airflow throughout the ventilation system of the building. This primary airflow power may be used to refresh the air within the facility, and maybe used to distribute chilled air from the chiller plant. As with thechiller plant, ventilation fans and their implementation within buildingcontrol systems are well known in the art. Also, the fan controllersubsystem 108 is similarly configured to receive input values from othersubsystems (or the supervisory computer 102) over the wireless areanetwork.

[0027] The room controllers 110, 112 and 114 are local controllersubsystems that operate to control an environmental aspect of a locationor “space” within the building. While such locations may be referred toherein as “rooms” for convenience, it will be appreciated that suchlocations may further be defined zones within larger open or semi-openspaces of a building. The environmental aspect(s) that are controllableby the space control subsystems 110, 112 and 114 typically includetemperature, and may include air quality, lighting and other buildingsystem processes.

[0028] In accordance with one aspect of the present invention, each ofthe space control subsystems 110, 112 and 114 has multiple elements thatcommunicate with each other using a second wireless communicationscheme. In general, it is preferable that the second communicationscheme employ a short-range or local RF communication scheme such asBluetooth. FIG. 2, discussed further below, shows a schematic blockdiagram of an exemplary room control system that may be used as thespace control subsystems 110.

[0029] Referring to FIG. 2, the space control subsystem 110 includes ahub module 202, first and second sensor modules 204 and 206,respectively, and an actuator module 208. It will be appreciated that aparticular room controller subsystem 200 may contain more or less sensormodules or actuator modules. In the exemplary embodiment describedherein, the space control subsystem 110 is operable to assist inregulating the temperature within a room or space pursuant to a setpoint value. The space control subsystem 110 is further operable toobtain data regarding the general environment of the room for use,display or recording by a remote device, not shown in FIG. 2, of thebuilding control system. (E.g., supervisory computer 102 of FIG. 1).

[0030] The first sensor module 204 represents a temperature sensormodule and is preferably embodied as a wireless integrated networksensor that incorporates microelectromechanical system technology(“MEMS”). By way of example, in the exemplary embodiment describedherein, the first sensor module 204 includes a MEMS local RFcommunication circuit 210, a microcontroller 212, a programmablenon-volative memory 214, a signal processing circuit 216, and one ormore MEMS sensor devices 218. The first sensor module 204 also containsa power supply/source 220. In the preferred embodiment described herein,the power supply/source 220 is a battery, for example, a lithium ionbattery.

[0031] Examples of MEMS circuits suitable for implementing the firstsensor module 204 are described in the ESSCIRC98 Presentation “WirelessIntegrated Network Sensors (WINS)”, which is published on-line atwww.janet.ucla.edu/WINS/archives, (hereinafter referred to as the “WINSPresentation”), and which is incorporated herein by reference. FIG. 6,discussed further below, describes a single substrate or single devicesolution for the sensor module 204.

[0032] The MEMS sensor device(s) 218 include at least one MEMS sensor,which may suitably be a temperature sensor, flow sensor, pressure sensorand/or gas-specific sensor. In a preferred embodiment, several sensorsare incorporated into a single device as a sensor suite 218. Uponinstallation, the sensor module 204 may be programmed to enable theparticular sensing capability, for example, temperature sensing.

[0033] By incorporating different, selectable sensor capabilities, asingle sensor module design may be manufactured for use in a largemajority of HVAC or other building automation and/or safety sensingapplications. As discussed below in connection with FIG. 6, a set ofselectable sensor devices may further include, by way of example, alight sensor, a heat or smoke sensor, a movement sensor, and/or abiometric sensor. MEMS devices capable of providing such sensorfunctionality have been developed and are known in the art. Inaccordance with one aspect of the invention, several known MEMS sensingtechnologies are incorporated into a single substrate. As a consequence,a manner, a single sensor module design may be used in a large number ofbuilding automation and/or safety applications.

[0034] In the embodiment of FIG. 2, the sensor module 204 is configuredto enable its temperature sensing function.

[0035] The signal processing circuit 216 includes the circuitry thatinterfaces with the sensor, converts analog sensor signals to digitalsignals, and provides the digital signals to the microcontroller 212.Examples of low power, micro-electronic A/D converters and sensorinterface circuitry are shown in the WINS Presentation.

[0036] The programmable non-volatile memory 214, which may be embodiedas a flash programmable EEPROM, stores configuration information for thesensor module 204. By way of example, programmable non-volatile memory214 preferably includes system identification information, which is usedto associate the information generated by the sensor module 204 with itsphysical and/or logical location in the building control system. Forexample, the programmable non-volatile memory 214 may contain an“address” or “ID” of the sensor module 204 that is appended to anycommunications generated by the sensor module 110.

[0037] The memory 214 further includes set-up configuration informationrelated to the type of sensor being used. For example, if the sensordevice(s) 218 are implemented as a suite of sensor devices, the memory214 includes the information that identifies which sensor functionalityto enable. (See FIGS. 3 and 4, discussed further below). The memory 214may further include calibration information regarding the sensor, andsystem RF communication parameters (i.e. the second RF communicationscheme) employed by the microcontroller 212 and/or RF communicationcircuit 210 to transmit information to other devices.

[0038] The microcontroller 212 is a processing circuit operable tocontrol the general operation of the sensor module 204. In general,however, the microcontroller 212 receives digital sensor informationfrom the signal processing circuit 216 and provides the information tothe local RF communication circuit 210 for transmission to a localdevice, for example, the hub module 202. The microcontroller 212 maycause the transmission of sensor data from time-to-time as dictated byan internal counter or clock, or in response to a request received fromthe hub module 202.

[0039] The microcontroller 212 is further operable to receiveconfiguration information via the RF communication circuit 210, storeconfiguration information in the memory 214, and perform operations inaccordance with such configuration information. As discussed above, theconfiguration information may define which of multiple possible sensorfunctionalities is to be provided by the sensor module 204. Themicrocontroller 212 employs such information to cause the appropriatesensor device or devices from the sensor device suite 218 to be operablyconnected to the signal processing circuit such that sensed signals fromthe appropriate sensor device are digitized and provided to themicrocontroller 212. As discussed above, the microcontroller 212 mayalso use the configuration information to format outgoing messagesand/or control operation of the RF communication circuit 210.

[0040] The MEMS local RF communication circuit 210 may suitably includea Bluetooth RF modem, or some other type of short range (about 30-100feet) RF communication modem. The use of a MEMS-based RF communicationcircuit allows for reduced power consumption, thereby enabling thepotential use of a true wireless, battery operated sensor module 204. Asuitable exemplary MEMS-based RF communication circuit is discussed inthe WINS Presentation.

[0041] As discussed above, it is assumed that the sensor module 204 isconfigured to operate as a temperature sensor. To this end, the memory214 stores information identifying that the sensor module 204 is tooperate as a temperature sensor. Such information may be programmed intothe memory 214 via a wireless programmer. The module 204 may beprogrammed upon shipment from the factory, or upon installation into thebuilding control system. The microcontroller 212, responsive to theconfiguration information, causes the signal processing circuit 216 toprocess signals only from the temperature sensor, ignoring output fromother sensors of the sensor suite 218.

[0042] It will be appreciated that in other embodiments, the sensorsuite 218 may be replaced by a single sensor. However, additionaladvantages may be realized through the use of a configurable sensormodule capable of performing any of a plurality of sensor functions. Asdiscussed further above, these advantages include the reduction of thenumber of sensor module designs.

[0043] In addition, the reduced wiring requirements and the reducedpower consumption of the above described design provides benefits evenin non-battery operated sensors.

[0044] The sensor module 206 is configured to operate as a flow sensorin the embodiment described herein. The sensor module 206 may suitablyhave the same physical construction as the sensor module 204. To thisend, the sensor module 206 includes a local RF communication circuit230, a microcontroller 232, a programmable non-volatile memory 234, asignal processing circuit 236, a sensor suite 238, and a powersupply/source 240. In contrast to the sensor module 204, however, thememory 234 of the sensor module 206 contains configuration informationidentifying that the sensor module 206 is to function as a flow sensor.

[0045] The actuator module 208 is a device that is operable to causemovement or actuation of a physical device that has the ability tochange a parameter of the building environment. For example, theactuator module 208 in the embodiment described herein is operable tocontrol the position of a ventilation damper, thereby controlling theflow of heated or chilled air into the room.

[0046] The actuator module 208 is also preferably embodied as a wirelessintegrated network device that incorporates microelectromechanicalsystem (“MEMS”) devices. By way of example, in the exemplary embodimentdescribed herein, the actuator module 208 includes a MEMS local RFcommunication circuit 250, a microcontroller 252, a programmablenon-volatile memory 254, and a signal processing circuit 256. Theactuator module 208 also contains a power supply/source 260. In thepreferred embodiment described herein, the power supply/source 260 is abattery, for example, a coin cell battery. However, it will beappreciated that if AC power is necessary for the actuator device (i.e.the damper actuator), which may be solenoid or value, then AC power isreadily available for the power supply/source 260. As a consequence, theuse of battery power is not necessarily advantageous.

[0047] The actuator 262 itself may suitably be a solenoid, steppermotor, brushless DC motor, or other electrically controllable devicethat drives a mechanical HVAC element. In the exemplary embodimentdescribed herein, the actuator 262 is a stepper motor for controllingthe position of a vent damper.

[0048] The MEMS local RF communication circuit 250 may suitably be ofsimilar construction and operation as the MEMS local RF communicationcircuit 210. Indeed, even if the MEMS local RF communication circuit 250differs from the RF communication circuit 210, it nevertheless shouldemploy the same communication scheme.

[0049] The microcontroller 252 is configured to receive control datamessages via the RF communication circuit 250. In the embodimentdescribed herein, the control data messages are generated andtransmitted by the hub module 202. The control data messages typicallyinclude a control output value intended to control the operation of theactuator 262. Accordingly, the microcontroller 252 is operable to obtainthe control output value from a received message and provide the controloutput value to the signal processing circuit 256. The signal processingcircuit 256 is a circuit that is configured to generate an analogcontrol signal from the digital control output value. In other words,the signal processing circuit 256 operates as an analog driver circuit.The signal processing circuit 256 includes an output 258 for providingthe analog control signal to the actuator 262.

[0050] The non-volatile memory 254 is a memory that containsconfiguration and/or calibration information related to theimplementation of the actuator 262. The memory 254 may suitably containsufficient information to effect mapping between the control variablesused by the hub module 202 and the control signals expected by theactuator 262. For example, the control variables used by the hub module202 may be digital values representative of a desired damper positioncharge. The actuator 262, however, may expect an analog voltage thatrepresents an amount to rotate a stepper motor. The memory 254 includesinformation used to map the digital values to the expected analogvoltages.

[0051] The hub module 202 in the exemplary embodiment described hereinperforms the function of the loop controller (e.g. a PID controller) forthe space control subsystem 110. The hub module 202 obtains processvariable values (i.e. sensor information) from either or both of thesensor modules 204 and 206 and generates control output values. The hubmodule 202 provides the control output values to the actuator module208. The hub module 202 also communicates with external elements of thebuilding control system, for example, the supervisory computer, fan orchiller control subsystems, and other room controller subsystems.

[0052] In the exemplary embodiment described herein, the hub module 202further includes sensor functionality. In general, it is oftenadvantageous to combine the hub controller core functionality with asensor function to reduce the overall number of devices in the system.Thus, some room control subsystems could include hub module 202 with anintegrated temperature sensor and one or more actuator modules. Separatesensor modules such as the sensor module 204 would not be necessary.

[0053] To accomplish these and other functions, the hub module 202includes a network interface 270, a room control processor 272, anon-volatile memory 274, a signal processing circuit 276, a MEMS sensorsuite 278 and a MEMS local RF communication circuit 280.

[0054] The network interface 270 is a communication circuit thateffectuates communication to one or more components of the buildingcontrol system that are not a part of the space control subsystem 110.Referring to FIG. 1, the network interface 270 is the device that allowsthe space control subsystem 110 to communicate with the supervisorycomputer 102, the fan controller subsystem 106, the chiller controllersubsystem 108 and/or the other room controller subsystems.

[0055] Referring again to FIG. 2, to allow for wireless communicationbetween controller subsystems of the building control system 100, thenetwork interface 270 is preferably an RF modem configured tocommunicate using the wireless area network communication scheme.Preferably, the network interface 270 employs a packet-hopping protocolto reduce the overall transmission power required. In packet-hopping,each message may be transmitted through multiple intermediate networkinterfaces before it reaches its destination. Referring again to FIG. 1,if the space control subsystem 110 sends a message to the fan controlsubsystem 106, the network interface of the space control subsystem 110provides the message to the physically closest subsystem. Thus, in theembodiment shown in FIG. 1, the network interface of the space controlsubsystem 110 provides the message to the network interface of the spacecontrol subsystem 112. The network interface of the space controlsubsystem 112 reads the destination address of the message anddetermines that the message is not intended to be received at the spacecontrol subsystem 112. As a consequence, the network interface of thespace control subsystem 112 passes the message along to the networkinterface of the next closes subsystem, which is the space controlsubsystem 114. The network interface of the space control subsystem 114similarly passes the message onto the fan control subsystem 116. Thenetwork interface of the fan control subsystem 116, however, recognizesfrom the destination address in the message that it is the intendedrecipient. The network interface of the fan control subsystem 116 thusreceives the message and processes it.

[0056] Referring again to FIG. 2, in order to facilitate the wirelessarea network operation described above, the network interface 270 ispreferably operable to communicate using a short range wirelessprotocol. The network interface 270 is further operable to, either aloneor in conjunction with the control processor 272, interpret messages inwireless communications received from external devices and determinewhether the messages should be retransmitted to another external device,or processed internally to the hub module 202. As discussed above, if apacket-hopping protocol is employed, the network interface 270 mayreceive a message intended for another subsystem. In such a case, thenetwork interface 270 retransmits the message to another device.However, if the network interface 270 includes a temperature set pointfor the space control subsystem 110 of FIG. 2, then the networkinterface 270 passes the information to the room control processor 272.

[0057] As discussed above, the hub module 202 may optionally includesensor capability. To this end, the MEMS sensor suite 278 may suitablyinclude a plurality of MEMS sensors, for example, a temperature sensor,flow sensor, pressure sensor, and/or gas-specific sensor. As with thesensor modules 204 and 206, the hub module 202 may be programmed toenable the particular desired sensing capability. In this manner, asingle hub module design may be manufactured to for use in a variety ofHVAC sensing applications, each hub module 202 thereafter beingconfigured to its particular use. (See e.g. FIGS. 3 and 4). However, itmay be sufficient to provide hub control modules having only temperaturesensing capability because rooms that employ an HVAC controller alsotypically require a temperature sensor. Thus, a temperature sensor onthe hub module will nearly always fill a sensing need when the hubmodule is employed.

[0058] The signal processing circuit 276 includes the circuitry thatinterfaces with the sensor suite 278, converts analog sensor signals todigital signals, and provides the digital signals to the room controlprocessor 272. As discussed above, examples of low power,micro-electronic A/D converters and sensor interface circuitry are shownin the WINS Presentation.

[0059] The programmable non-volatile memory 274, which may be embodiedas a flash programmable EEPROM, stores configuration information for thehub module 274. By way of example, programmable non-volatile memory 274preferably includes system identification information, which is used toassociate the information generated by the sensor module 274 with itsphysical and/or logical location in the building control system. Thememory 274 further includes set-up configuration information related tothe type of sensor being used. The memory 274 may further includecalibration information regarding the sensor, and system RFcommunication parameters employed by the control processor 272, thenetwork interface 270 and/or the local RF communication circuit 280.

[0060] The MEMS local RF communication circuit 280 may suitably includea Bluetooth RF modem, or some other type of short range (about 30-100feet) RF communication modem. The MEMS local RF communication circuit280 is operable to communicate using the same RF communication scheme asthe MEMS local RF communication circuits 210, 230 and 250. As with thesensor module 204, the use of a MEMS-based RF communication circuitallows for reduced power consumption, thereby enabling the potential useof a true wireless, battery operated hub module 202. Moreover, it may bepossible and preferable to employ many of the same RF elements in boththe local RF communication circuit 280 and the network interface 270.Indeed in some cases, the local RF communication circuit 280 and thenetwork interface 270 are substantially the same circuit. In any event,a suitable MEMS-based RF communication circuit is discussed in the WINSPresentation.

[0061] The control processor 272 is a processing circuit operable tocontrol the general operation of the hub module 274. In addition, thecontrol processor 272 implements a control transfer function to generatecontrol output values that are provided to the actuator module 208 inthe space control subsystem 110. To this end, the control processor 272obtains sensor information from its own sensor suite 278 and/or fromsensor modules 204 and 206. The control processor 272 also receives aset point value, for example, from the supervisory computer 102 via thenetwork interface 270. The control processor 272 then generates thecontrol output value based on the set point value and one or more sensorvalues. The control processor 272 may suitably implement aproportional-integral-differential (PID) control algorithm to generatethe control output values. Suitable control algorithms that generatecontrol output values based on sensor or process values and set pointvalues are known.

[0062] Exemplary sets of operations of the room control system 110 isshown in FIGS. 3, 4 and 5. In general, FIGS. 3, 4 and 5 illustrate howthe hub module 202, the sensor module 204 and actuator 208 operate toattempt to control aspects of the environment of the room. Morespecifically, FIG. 3 shows an exemplary set of operations of the hubmodule 202, FIG. 4 shows an exemplary set of operations of the sensormodule 204, and FIG. 5 shows an exemplary set of operations of theactuator module 208.

[0063] Referring particularly to FIG. 3, the operations shown thereinwill be described with contemporaneous reference to FIG. 2. Theoperations of FIG. 3 are performed by the room control processor 272,which generally controls the operation of the hub module 202.

[0064] Steps 302, 304 and 306 all represent operations in which the roomcontrol processor 272 receives input values from various sources. Theorder in which those steps are performed is not of critical importance.

[0065] In step 302, the processor 272 receives a flow value from thesensor module 206, which in the exemplary embodiment described hereinhas been configured as a flow sensor module. To receive a flow valuefrom the sensor module 206, the processor 272 causes the local RFcommunication circuit 280 to be configured to receive a transmittedmessage from the local RF communication circuit 230 of the sensor module206. When a message is received, the local RF communication circuit 280and/or the processor 278 verify the source and intended destination ofthe message. If the message is legitimately intended for the hub module202, then the processor 278 parses the sensor value from the message forsubsequent use.

[0066] In step 304, the processor 272 receives temperature measurementvalues from the sensor module 204 as well as its internal temperaturesensor device 278. In many cases, only a single temperature sensor valueis necessary, in which case the hub module 202 need not include thetemperature sensor 278, or, alternatively, the sensor module 204 wouldnot be necessary. In the exemplary embodiment described herein, however,it will be assumed that the processor 272 receives temperature valuesfrom both the temperature sensor device 278 and the sensor module 204.To receive a temperature value from the sensor module 204, the processor272 and local RF communication circuit 280 operate in the same manner asthat described above in connection with receiving flow sensor valuesfrom the sensor module 206. To receive a temperature value from thesensor 278, the processor 272 receives digital sensor information fromthe signal processing circuit 276.

[0067] In step 306, the processor 272 obtains a set point value throughthe network interface 270. In particular, in the embodiment describedherein, the set point temperature for the room in which the controlsubsystem 110 is disposed is provided from a device external to thecontrol subsystem 110. For example, the supervisory computer 102 of FIG.1 may provide the temperature set points for all of the space controlsubsystems 110, 112 and 114 in the building control system 100. It willbe noted, however, that in alternative embodiments, the set point may bederived from a manually-adjustable mechanism directly connected to thehub module 202.

[0068] To receive the set point value from the external device, thenetwork interface 270 monitors transmissions in the WAN on which thevarious subsystems communicate. If a message including a set pointintended for the space control subsystem 110 is received by the networkinterface 270, then that message will be provided to the processor 272.In such a case, the processor 272 parses out the set point informationfor subsequent use, such as use in the execution of step 308, discussedbelow.

[0069] In step 308, the processor 272 generates a control output valuebased on the most recently received set point value and temperaturesensor values. To this end, the processor 272 may suitably employ a PIDcontroller algorithm to generate the control output value. In theembodiment described herein, the control output value is representativeof a desired change in a vent damper position. For example, if chilledair is provided through the vent, and the sensor temperature valueexceeds the set point temperature value, then the control output valueidentifies that the vent damper must be opened further. Further openingthe vent damper allows more chilled air to enter the room, therebyreducing the temperature.

[0070] A PID control algorithm that is capable of generating a ventdamper position based on a difference between temperature sensor valuesand a set point temperature value would be known to one of ordinaryskill in the art. In general, it will be noted that the use ofparticular control system elements such as temperature sensors, setpoint temperatures, and vent dampers are given by way of illustrativeexample. The use of control systems and subsystems with reduced wiringas generally described herein may be implemented in control systemsimplementing a variety of sensor devices and actuators or othercontrolled devices.

[0071] Referring again to the specific embodiment described herein, itwill be appreciated that during ongoing operation, the processor 272does not require an update in each of steps 302, 304 and 306 prior toperforming step 308. Any update received in any of those steps canjustify a recalculation of the control output value. Moreover, theprocessor 272 may recalculate the control output value on a scheduledbasis, without regard as to which input values have changed.

[0072] In step 310, the processor 272 causes the generated controloutput value to be communicated to the actuator module 208. To this end,the processor 272 and the local RF communication circuit 280 cooperateto generate a local RF signal that contains information representativeof the control output value. The processor 272 may suitably add adestination address representative of the actuator module 208 to enablethe actuator module 208 to identify the message.

[0073] It is noted that in the exemplary embodiment described herein,the flow sensor value received from the flow sensor module 206 is notused in the PID control calculation performed by the processor 272. Thatvalue is obtained so that it may be used by other subsystems or by thesupervisory computer 102. Indeed, multiple sensor values are typicallycommunicated to external subsystems.

[0074] To this end, in step 312, the processor 272 causes the networkinterface 270 to transmit received sensor values to devices external tothe room control subsystem 110. For example, the processor 272 may causetemperature and flow sensor values to be transmitted to the supervisorycomputer 102. The supervisory computer 102 may then use the informationto monitor the operation of the building control system. Moreover,temperature and/or flow sensor values from various space controlsubsystems may be employed by the fan control subsystem 108 to adjustoperation of one or more ventilation fans, or by the chiller controlsubsystem 106 to adjust operation of the chiller plant. Accordingly, theprocessor 272 must from time to time cause sensor values generatedwithin the space control subsystem 110 to be communicated to externaldevices through the network interface 270.

[0075] The room control processor 272 repeats steps 302-312 on acontinuous basis. As discussed above, the steps 302-312 need not beperformed in any particular order. New sensor and/or set point valuesmay be received periodically either on a schedule, or in response torequests generated by the processor 272.

[0076] With regard to the sensor values, FIG. 4 shows an exemplary setof operations performed by the sensor module 204 in generating andtransmitting temperature sensor values to the hub module 202 inaccordance with step 302 of FIG. 3. The sensor module 206 may suitablyperform a similar set of operations to generate and transmit flow sensorvalues to the hub module 202 in accordance with step 304 of FIG. 3.

[0077] Referring now to FIG. 4, the operations shown therein areperformed by the microcontroller 212 of the sensor module 204. In step402, the microcontroller 212 determines whether it is time to transmitan updated temperature value to the hub module 202. The determination ofwhen to transmit temperature values may be driven by a clock internal tothe sensor module 204, or in response to a request or query receivedfrom the hub module 202, or both. In either event, if it is not time totransmit an update, the microcontroller 212 repeats step 402.

[0078] If, however, it is determined that an update should betransmitted, then the microcontroller 212 proceeds to step 404. In step404, the microcontroller 212 obtains a digital value representative of ameasured temperature from the signal processing circuit 216. To thisend, the microcontroller 212 preferably “wakes up” from a power savingmode. The microcontroller 212 preferably also causes bias power to beconnected to power consuming circuits in the signal processing circuit216, such as the A/D converter. In this manner, power may be conservedby only activating power consuming circuits when a temperature sensorvalue is specifically required. Otherwise, the power consuming devicesremain deactivated. Thus, for example, if a temperature value need onlybe updated every fifteen seconds, many of the power consuming circuitswould only be energized once every fifteen seconds. However, it is notedthat if the power source 220 is derived from AC building power, the needto reduce power consumption is reduced, and the microcontroller 212 andthe signal processing circuit 216 may receive and process digitaltemperature sensing values on an ongoing basis.

[0079] In any event, after step 404, the microcontroller 212 proceeds tostep 406. In step 406, the microcontroller 212 converts the senseddigital temperature value into the format expected by the room controlprocessor 272 of the hub module 202. The microcontroller 212 furtherprepares the message for transmission by the local RF communicationcircuit 210. Once the message including the sensor temperature value isprepared, the microcontroller 212 in step 408 causes the local RFcommunication circuit 210 to transmit the message. The message isthereafter received by the hub module 202 (see step 304 of FIG. 3).Thereafter, the microcontroller 212 may return to step 402 to determinethe next time an update is required.

[0080]FIG. 5 shows an exemplary set of operations that may be performedby the microcontroller 252 of the actuator module 208. As discussedabove, one purpose of the space control subsystem 110 is to control thephysical operation of a device to help regulate a process variable, inthis case, the room temperature. The actuator module 208 thus operatesto carry out the actions determined to be necessary in accordance withthe control algorithm implemented by the room process controller 272.

[0081] First, in step 502, a message which may include the controloutput value is received from the hub module 202. To this end, the RFcommunication circuit 250 receives the message and provides the messageto the microcontroller 252. Thereafter, in step 504, the microcontroller252 determines whether the received message is intended for receipt bythe actuator module 208. If not, then the microcontroller 252 returns tostep 502 to await another incoming message.

[0082] If, however, the microcontroller 252 determines in step 504 thatthe received message is intended for the actuator module 208, then themicrocontroller 252 proceeds to step 506. In step 506, themicrocontroller 252 parses the message to obtain the actuator controloutput value, and converts that value into a value that will cause theactuator to perform the requested adjustment. For example, if thereceived control output value identifies that the ventilator dampershould be opened another 10%, then the microcontroller 252 wouldgenerate a digital output value that, after being converted to analog inthe signal processing circuit 256, will cause the actuator 258 to openthe ventilator damper another 10%.

[0083] In step 508, the microcontroller 252 actually provides thedigital output value to the signal processing circuit 256. The signalprocessing circuit 256 then converts the value to the correspondinganalog voltage expected by the actuator device 258. Thereafter, themicrocontroller 252 returns to step 502 to await the next messagereceived from the hub module 202.

[0084] The above described space control subsystem 110 is merely anexemplary illustration of the principles of the invention. Theprinciples of the invention may readily be applied to control subsystemshaving more or less sensors or actuators, as well as other elements, andto control subsystems that control other aspects of the building controlsystem. By way of example, my co-pending application entitled “BuildingControl System and Fume Hood System for Use Therein Having ReducedWiring Requirements”, Attorney Docket No., 2003 P 01153 US, filed oneven date herewith, which is owned by the assignee of the presentinvention and incorporated herein by reference, describes anotherexemplary space control subsystem that may be used in the system 100.

[0085] The relatively low power requirements enabled by the use of MEMSdevices and local RF communications in the sensor modules and even thehub module allow for implementation of the modules in battery operatedformat. Thus, a mostly wireless building control system may bedeveloped. However, as discussed above, many advantages of the presentinvention may be obtained in systems that use other forms of power.

[0086] As discussed above, one of the advantages provided by the sensormodule design discussed above (e.g. the sensor module 204) is that itmay be configured to perform a variety of different sensor operations.

[0087]FIGS. 6 and 7 shows an exemplary MEMS-based module 600 that may bereadily be used as a sensor module in a plurality of HVAC, buildingsafety, building automation and other systems. In general, the module600 is implemented as a single, self-powered, standalone device in whichmost of the active components are integrated onto one or twosemiconductor substrates.

[0088] Referring now to FIG. 6, the module 600 in the embodimentdescribed herein includes a top semiconductor layer 602, a lithium ionbattery layer 604 and a bottom semiconductor layer 606. The variousfunctions of the module 600, discussed below in connection with FIG. 7,are incorporated into the top and bottom semiconductor layers 602 and606. The lithium ion battery layer 604 provides a source of electricalpower to the top and bottom semiconductor layers 602 and 606. Thelithium ion battery layer 604 is preferably disposed between the top andbottom semiconductor layers 602 and 606 to provide an advantageous,space-efficient layout. Various interconnects may be provided betweenthe two semiconductor layers 602 and 606 around the lithium ion batterylayer 604 as need. In the alternative, one of the two layers may bededicated completely to a light-powered recharging circuit for thelithium ion battery layer 604.

[0089]FIG. 7 shows a block diagram representation of the module circuits700 that are implemented into the semiconductor layers 602 and 606 ofthe module 600. The module circuit 700 include a sensor suite 702, anEEPROM 704, a processing circuit 706, a power management circuit 708 andan RF communication circuit 710.

[0090] The RF communication circuit 710 is a MEMs based communicationcircuit such as that described above in connection with FIG. 2. The RFcommunication circuit 710 is preferably configured to communicate usingat least one local RF communication format, such as Bluetooth.

[0091] The power management circuit 708 that preferably operates torecharge the lithium ion battery layer 604 of FIG. 6, and may includesemiconductor devices that convert light or RF energy into electricalenergy that may be used to trickle charge the lithium ion battery.

[0092] The sensor suite 702 is collection of MEMs sensors incorporatedinto a single substrate. The incorporation of multiple MEMs sensortechnologies is known. For example, Hydrometrics offers for sale a MEMssensor device that includes both temperature and humidity sensingfunctions. MEMs based light, gas content, temperature, flow, smoke andother sensing devices are known. Such devices are in the embodimentdescribed herein implemented onto a single substrate 602 or 606, or pairof substrates 602 and 606.

[0093] The processing circuit 706 preferably incorporates amicroprocessor or microcontroller, as well as microelectronics A/Dcircuits for connecting to the MEMs sensor devices of the sensor suite702. In the embodiment described herein the signal processing circuit706 otherwise controls the operations of the module 600 in the mannerdescribed above in connection with the signal processing circuit 216 andcontroller 212 of the sensor module 204 of FIG. 2.

[0094] The EEPROM 704 (which may be another type of non-volatile,chip-based memory such as ferro-electric or ferro-magnetic RAM) is anon-volatile memory that stores the configuration information for themodule 600. For example, the EEPROM 704 may store ID information used toidentify the module 600 to the system in which it is connected. TheEEPROM 704 also stores information related to the function in which themodule 600 will be used. For example, the EEPROM 704 may storeinformation identifying that the module 600 should enable itstemperature sensing function as opposed to any of its other possiblesensing functions.

[0095] As discussed above in connection with FIG. 2, the configurationinformation in the EEPROM 704 may simply identify the intendedfunctionality of the module 600, which would then cause the processingcircuit 706 to execute portions of program code stored in ROM (notshown) to carry out that functionality. To this end, the EEPROM 704 maybe replaced by a set of DIP switches that may be manually manipulated toset the configuration of the module 600. In either case, suchembodiments would require that most of the program code for a variety ofdifferent sensor functions be stored in ROM, only a portion of whichwould be used once the configuration information is received.

[0096] However, in one embodiment of the invention, most or all of thecode unique to the selected function of the module is downloaded intothe EEPROM 704 during configuration of the device. Thus, if the module600 is to operate as a temperature sensor module, then all appropriatecode for a temperature sensor module is downloaded to the EEPROM 704, asis identification information and calibration information.

[0097] Regardless of whether the EEPROM 704 is configured via largeamounts of programming code, or through flags and parameters that areused to select pre-existing code within the module 700, theconfiguration information is downloaded to the EEPROM from an externaldevice, for example, a portable programming device. In particular, aportable programming device provides programming instructions via RFsignals to the RF communication circuit 710. The processing circuit 706obtains the programming instructions from the RF communication circuit710 and stores the instructions into the EEPROM 704. It will beappreciated that other techniques for providing configurationinformation to the EEPROM 704 may be used.

[0098] Thus, the above described module 600 may readily be configured asany one of a large plurality of sensor types or even other types ofbuilding automation system components. As a consequence, large amountsof the devices may be fabricated, thereby reducing the per-unit toolingand design costs associated with ordinary building automation sensors.In addition, the highly integrated nature of the devices reducesshipping and storage costs, as well as reduces power consumption. Itwill be noted that the design of the module 600 may not only be used asthe sensor modules 204, 206 in the exemplary space control subsystem 200of FIG. 2, but may also be used as the hub module 202. The networkinterface 270 of the hub module 202 may be configured to operate via theRF communication circuit 710 of the module 600 of FIGS. 6 and 7.

[0099] It will be appreciated that the module 600 may be made universalfor use as both a sensor module or an actuator module. To this end, themodule 600 would not include an actuator (e.g. the actuator 262 of FIG.2), but rather outputs to an external actuation device which in theexemplary embodiment described herein may be any commercially availablebuilding control system actuator. To this end, the processing circuit706 is configured to generate digital or analog outputs to a wide rangeof actuator devices. To accommodate the different actuator designs,device driver information for the actuator device is programmed into theprocessor of the processing circuit 706 (and/or may be partly or fullystored in the EEPROM 704). Moreover, the processing circuit 706 itselfincludes digital to analog conversion circuitry. Thus, preferably, theprocessing circuit 706 preferably includes digital to analog and analogto digital conversion circuitry to allow both sensor input and actuatoroutput. It is also noted that the processing circuit 706 may alsoinclude inherent memory that incorporates routines forself-commissioning, self-configuring and fault diagnostics for themodule 600.

[0100] In another aspect of the invention, a space control subsystemexemplified by the space control subsystem 110 of FIG. 2 may readily bemodified for use in a conventional wired building control system. Such aspace control subsystem would still provide the advantage of a mostlywireless room subsystem, which will greatly reduce the labor involved ininstallation of the space control subsystem. Indeed, one aspect of thepresent invention is a method of retrofitting an existing buildingautomation or HVAC system with wireless subsystem modules such as themodules 600 of FIGS. 6 and 7 or the modules 204, 206 of FIG. 2.

[0101] To illustrate this concept, FIGS. 8, 9 and 10 illustrateprogressive steps in a partial retrofit of an ordinary prior art wiredbuilding automation system. FIG. 8 shows a prior art building automationsystem 800 before it is to retrofitted with wireless modules. FIG. 9shows the building automation system 800′ with an isolated subsystemreplaced by a wireless retrofit subsystem 902. FIG. 10 shows thebuilding automation system 800″ with multiple subsystems replaced by thevarious wireless modules and subsystems.

[0102] Referring to FIG. 8, the prior art building automation systemincludes at least one supervisory control system 802, a system database804, plural network managers 806 a and 806 b, and plural subsystems 808a-808 e.

[0103] Each of the subsystems 808 a-808 e represents one of plurality oflocalized, standard building automation subsystems, such as spacetemperature control subsystems, a lighting control subsystems, or thelike. Each subsystem typically includes a controller, such as, forexample, the model Predator controller available from Siemens BuildingTechnologies of Buffalo Grove, Ill. Larger, more complex subsystems suchas chiller plant control subsystems may employ a model Raptorcontroller, also available from Siemens Building Technologies. Groups ofsubsystems such as subsystems 808 a and 808 b are typically organizedinto networks and generally operate in a master/slave relationship witha network manager such as the network manager 806 a. The network managermay suitably be a TALON Network Manager, also available from SiemensBuilding Technologies.

[0104] To facilitate communication between the various subsystems of thelocal networks, the subsystems 808 a and 808 b and the network manager806 a are all connected to a local, low-level data network 810 a,sometimes referred to as a floor network. The data network may suitablyemploy the standardized LonTalk protocol. Subsystems 808 c, 808 d and808 e along with the network manager 806 b are similarly connected viaanother low-level data network 810 b.

[0105] The network managers 806 a and 806 b are also connected via anenterprise network 812 to the supervisory computer 802 and the database804. The network managers 806 a and 806 b thereby coordinate thecommunication of data and control signals between the subsystems 808a-808 e and the supervisory computer 802 and database 804. Thesupervisory computer 802, similar to the supervisory computer 102 ofFIG. 1, provides overall control of the building automation system 800and includes a user interface. The database 804 stores historical data,error data, and other logged events. The enterprise network 812 mayconnect to other supervisory computers, Internet gateways, or othergateways to other external devices, as well as additional networkmanagers (which in turn connect to more subsystems via additional lowlevel data networks). The enterprise network 812 may suitably comprisean Ethernet or similar wired network and may employ TCP/IP, BACnet, XMLand/or other protocols that support high speed data communications.

[0106] In addition to the large amount of wiring necessitated by thenetworks 810 a, 810 b and 812, each subsystem 808 a-808 e itselfrequires significant amounts of wiring. Accordingly, replacing thesystem 800 with a wireless system similar to the wireless system 100 ofFIG. 1 would greatly reduce the wiring of the building automationsystem. However, it is not always economically or logistically possibleto replace an entire building automation system at one time.

[0107] Accordingly, in accordance with one aspect of the invention, theportions of the building automation system 800 may be progressivelyretrofitted with wireless systems based on the wireless modulesdescribed above in connection with FIGS. 2, 6 and 7.

[0108] A first step in retrofitting the network 800 consists ofreplacing individual subsystems with wireless subsystems. The wirelesssubsystems have the general configuration as those described above inconnection with FIGS. 1 and 2. FIG. 9 shows the network 800′ with onestandard subsystem 808 b (see FIG. 8) replaced by a retrofit subsystem902 that includes a wireless interface 904 and a wireless subsystem 906.The wireless interface 904 is a device that operates as an interfacebetween the low-level wired data network 810 a and the wireless RFprotocol employed by the wireless subsystem 906. The wireless subsystem906 may suitably have the structure of any of the space controlsubsystems 106, 108, 110, 112, and 114 of FIG. 1. Moreover, by employingthe wireless interface 904 to translate between the wired data network810 and the wireless control subsystems, the wireless control subsystemsmay be made up of standard modules such as the wireless module 600 ofFIGS. 6 and 7. As a consequence, the wireless module 600 could beequally useful without physical alteration in either a total wirelessbuilding automation system such as the system 100 of FIG. 1, or as partof a retrofit of a wired building system such as the building automationsystem 800 of FIG. 8.

[0109] In addition, as shown in FIG. 9, the retrofit subsystem 902 istransparent to the building automation system 800′, and thus may beimplemented without disrupting the existing system.

[0110]FIG. 10 shows an advanced state of retrofit in which an entire setof subsystems 808 a and 808 b (and the corresponding network manager 806a) are replaced by a retrofit subnetwork 1002. The retrofit subnetwork1002 includes a wireless interface 1004, a first wireless subsystem 1006a and a second wireless subsystem 1006 b.

[0111] The wireless interface 1004 operates as an interface between thewired enterprise network 812 and the wireless subsystems 1006 a and 1006b. Each of the wireless subsystems 1006 a and 1006 b may suitablycomprise a wireless subsystem such as any of the subsystems 106, 108,110, 112 or 114 of FIG. 1. The wireless subsystems 1006 a and 1006 b,however, also communicate between themselves using a wireless protocol,such as the packet hopping scheme described above in connection withFIG. 1. Accordingly, the need for the network manager 806 a may beeliminated. The data interface/management functionality previouslyprovided by the network manager 806 a may readily be programmed into awireless module (see e.g. module 600 of FIGS. 6 and 7) of one of thesubsystems 1006 a or 1006 b.

[0112] One or more other groups of subsystems may similarly be replaceduntil the entire building automation system 800″ begins to resemble thesystem 100 of FIG. 1. Thus, FIGS. 9 and 10 illustrate how an existing,prior art wired building automation system may be progressivelyretrofitted with wireless components and subsystems, using wirelessmodules and subsystems described herein.

[0113] It will be appreciated that the above described embodiments aremerely illustrative, and that those of ordinary skill in the art mayreadily devise their own adaptations and implementations thatincorporate the principles of the present invention and fall within thespirit and scope thereof. For example, while it is noted above that thehub module may further including sensing capability, it should furtherbe appreciated that the hub module may instead include actuator modulecapabilities. Moreover, the PID control algorithm performed by thecontrol processor 272 may instead be carried out by any of themicrocontrollers 212, 232 or 252.

[0114] Another notable drawback of prior art building automation systemsis their inability to understand the environment and the dynamicsassociated with it. The environment it controls or manages largely usesa limited number of temperature sensors, especially for comfort. Theprior art systems employ simple strategies to maintain indoor airquality again using a few sensors. The building components that actuallyconstitute environment such as occupants, envelopes, equipment etc. aretotally disconnected from the building automation system, and do notshare any responsibility nor do they provide any feedback to thebuilding automation system for the overall environment management. Thebuilding automation system is usually imposed upon the physical systemand it attempts to maintain a controlled environment using a few sensorsand distributed controllers. By defining a true environment and allowingall the components within it to share and to cooperate with a commongoal of maintaining a healthy, safe and productive environment will be amajor breakthrough for building automation systems and for that matterfor the entire building industry. Technologies are emerging fast thatcan create such environment cost-efficiently.

[0115] A holistic view of an advanced building system environment isdescribed briefly below. The scope of advanced building systems includeseverything within the building as opposed to the control environment ofcurrent building system as described before. The core of the advancedbuilding system is based on the fact that it is not a system that isimposed on the building environment but instead includes environmentcomponents and even occupants as active participants within thatbuilding system. The advanced building system includes buildingcomponents like walls and fenestration that now use substrate-basedcompounds capable of changing their characteristics in response tooutdoor environment. For example, when the building system senses thatthe outdoors temperature or solar gain is high, it increases electricalsignal through the wall and fenestration causing the substrate propertyto change and block much of the heat gain. Thus, the building system isallowed to control the injection of the heat input to the space right atits entry point. The reverse phenomenon occurs when the building systemallows more heat actually to penetrate the building envelope for heatingapplication.

[0116] The advanced building system also employs a series of localheating and cooling using micro heat exchangers that are designed tooffset local gain or loss of heat. The resultant affect is that thespace does not require any cooling or heating from a traditional sourceof large plant except for its ventilation need. Even there the plant canuse micro- combined cooling, heating and power plant using fuel cell,micro-turbines or similar technologies. By being able to control theheat disturbances at the points of entry to the space and usingmicrotechnology, the overall building cooling and heating plants will besmaller, environmentally benign and smarter.

[0117] The above described building system will utilize a large numberof modules such as the module 600 of FIGS. 6 and 7 distributedthroughout the space providing smart sensing and control in order toachieve a variety of goals including comfort, building protection,security, Indoor Air Quality (IAQ) and performance optimization. Thestandard wireless protocol employed by the module 600 providessignificant advantage in installation and operation.

I claim:
 1. A controller arrangement for a building system, thearrangement comprising: a sensor module comprising a wirelesscommunication device and a microelectromechanical sensor device operableto generate a process value; an actuator module comprising an actuationelement and a wireless communication device; a controller operable toobtain the process value from the sensor device and provide a controloutput to the actuation element, the controller further operable tocommunicate with at least one of the sensor module and the actuatormodule using wireless communications, the controller further operablyconnected to receive a set point value, wherein the controller isoperable to generate the control output based on the process value andthe set point value.
 2. The controller arrangement of claim 1 whereinthe sensor module further comprises the controller, and the controlleris further operable to provide the control output to the actuator moduleusing wireless communications.
 3. The controller arrangement of claim 1wherein the actuator module further comprises the controller, and thecontroller is further operable to obtain the process value from thesensor module using wireless communications.
 4. The controllerarrangement of claim 1 further comprising a communication circuitcoupled to the controller, the communication circuit operably coupled toreceive the set point value from a remote device.
 5. The controllerarrangement of claim 4, wherein the communication circuit furthercomprises a wired data network interface circuit.
 6. The controllerarrangement of claim 4, wherein the communication circuit furthercomprises a wireless area network interface circuit.
 7. The controllerarrangement of claim 1, wherein the sensor module includes a pluralityof microelectromechanical sensors, at least one of the plurality ofmicroelectromechanical sensors generating the process variable.
 8. Thecontroller arrangement of claim 7, wherein less than all of theplurality of microelectromechanical sensors generate the processvariable.
 9. The controller arrangement of claim 1, wherein the wirelesscommunication device of the sensor module employs a Bluetoothcommunication protocol and the wireless communication device of theactuator module employs the Bluetooth communication protocol.
 10. Abuilding control system comprising: a plurality of controllerarrangements, each controller arrangement including a controlleroperable to generate a control output value based on at least oneprocess value and at least one set point value, at least one sensormodule operable to generate the at least one process value, the at leastone sensor module operably connected to the controller, a first wirelesscommunication interface operably coupled to the controller, the firstwireless communication interface configured to communicate informationwith a remote element of the building control system using a firstwireless communication scheme.
 11. The building control system of claim10 wherein the remote element comprises a central controller operable tocommunicate information with the controllers of each of the plurality ofcontroller arrangements.
 12. The building control system of claim 10wherein the remote element comprises a controller of at least one othercontroller arrangement.
 13. The building control system of claim 10wherein the at least one sensor module includes a microelectromechanicalsensor device.
 14. The building control system of claim 10 wherein theat least one sensor module includes a wireless communication interfaceoperable to communicate information with the controller using a secondwireless communication scheme.
 15. The building control system of claim10 wherein at least some of the plurality of controller arrangementsinclude an actuator module, the actuator module operably connected tothe controller to receive the control output value therefrom, theactuator module operable to cause actuation of an actuation elementresponsive to the control output value.
 16. The building control systemof claim 10 wherein each of the actuator module includes a wirelesscommunication interface, and wherein the controller is configured tocommunicated the control output value to the actuator module using asecond wireless communication scheme.
 17. The building control system ofclaim 10 wherein the first wireless communication scheme comprises awireless area network communication scheme.
 18. A method comprising:effecting wireless communications between at least two elements of acontroller arrangement in a building control system using a firstwireless communication scheme; and effecting wireless communicationsbetween the between at least to controller arrangements in a buildingcontrol system using a second wireless communication scheme.
 19. Themethod of claim 18 wherein the at least two elements are selected fromamong a controller operable to generate a control output value based ona process value and a set point value, a sensor module configured togenerate the process value, and an actuator module operable to receivethe control output value.
 20. The method of claim 18 wherein the firstwireless communication scheme employs the Bluetooth protocol.
 21. Themethod of claim 21 wherein the second wireless communication schemeemploys a wireless area network protocol.
 22. An apparatus for use in abuilding automation system, the apparatus comprising: a plurality ofmicroelectromechanical sensors disposed on a single substrate; anon-volatile memory operable to store configuration information, theconfiguration information corresponding to a first functionality of theapparatus; a communication device operable to communicate sensor valuesto an external device; and a processing device operably coupled to eachof the plurality of microelectromechanical sensors to receivemeasurement information therefrom, the processing device operable toprovide the sensor values to the communication circuit, wherein saidsensor values correspond to a select subset of themicroelectromechanical sensors, the select subset based on theconfiguration information stored in the non-volatile memory.
 23. Theapparatus of claim 22 wherein the processing device is disposed on thesingle substrate.
 24. The apparatus of claim 22 further comprising alithium ion battery affixed to the single substrate, the lithium ionbattery operable to provide electrical power to the processing circuit.25. The apparatus of claim 22 wherein said configuration informationincludes a unique device identifier.
 26. The apparatus of claim 22wherein the communication device comprises an RF communication device.